It does not contain solvents and inorganic fillers, and is safe and harmless to the human body. Suitable for bonding resin materials and ceramic materials. Irradiate with an oral light curing light source of 300mW/c ㎡for 20 seconds to cure the adhesive.
It does not contain solvents and inorganic fillers, and is safe and harmless to the human body. Suitable for bonding resin materials and ceramic materials. Irradiate with an oral light curing light source of 300mW/c ㎡for 20 seconds to cure the adhesive.